No 7, Lorong Industri Sungai Lokan 2, Taman Industri Sungai Lokan, 13800 Butterworth, Penang, Malaysia
4x10Gbps Φ50μm 250μm Die Pitch 1x4 Array PIN PD Chip
P/N: XSJ-10-D5-50H-K4
The high-speed 4X10Gbps photodetector chip is an InGaAs/I InP PIN structure and front illuminated type, characterized by high responsiveness, low capacitance, and low dark current. The size of the photosensitive area is 50um, and the P and N pads are designed at the top for easy packaging of solder wires. Mainly paired with 4X10Gbps four channel TIA, it is used for long-distance, high-speed, and single-mode 4X10G bps optical receivers and data communication.
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Description
Features
- Φ50μm active area.
- Ground-Signal-Ground (GSG) bond pad structure, 4X10Gbps array.
- Low dark current, low capacitance, high responsibility.
- Die pitch: 250μm
- 100% testing and inspection.
- Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
- RoHS2.0 (2011/65/EU) compliant.
Applications
- 40Gbps QSFP+ LR4
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